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Osaka Grinding Processing [Internal Diameter, Cylindrical (External Diameter), Surface Grinding Processing]

A group of grinding professionals! We can achieve coaxiality, concentricity, and parallelism at 1μm.

Our company processes inner diameters, outer diameters, and flat grinding in-house. Since we can perform integrated processing, we can also shorten lead times. We are equipped with a range of machines from rotary grinders to general-purpose grinders. Please feel free to contact us if you have any requests. 【Features】 ■ Achieves coaxiality, concentricity, and parallelism within 1μm ■ Utilizes the know-how and network developed over many years to accommodate various products ■ Flexible response to materials such as SKD, SUS, and SKH *For more details, please download the PDF or contact us.

  • Wafer processing/polishing equipment
  • Processing Contract
  • Osaka Grinding

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